OpenShort™ Coordinate Conversion Product

OpenShort™ Coordinate Conversion Product
  Toward the defect analysis of 45/40 technology node process, it has become very difficult to discover failure defect with the traditional defect analysis method. By then, design layout was utilized in the defect analysis.
  Elite Semiconductor Inc. was the first company to achieve the solution of converting inline defect coordinate into design layout coordinate accurately.
  A first Coordinate Conversion was first developed in early 2010. Soon, a revised Mask Frame-based Coordinate Conversion proved its accuracy in May, 2010 under all kind of wafer inspection conditions. The OpenShort™ Coordinate Conversion Product paves the foundation to execute Killer Defect Index accurately.
  The OpenShort™ Coordinate Conversion Product can be licensed and used in the application of Pattern Grouping in a systematic defect test, Killer Defect Index in a nuisance defect and killer defect classification, inline defect to design layout pattern for failure analysis, etc.

  The ESI OpenShort™ Coordinate Conversion Product can accurately convert the inline defect coordinate of a defect file into the corresponding design layout coordinate.

ESI OpenShort™ Coordinate Conversion Product
Toward the defect analysis of 45/40 technology node process, it has become very difficult to discover failure defect with the traditional defect analysis method. By then, design layout was utilized in the defect analysis.
  Elite Semiconductor Inc. was the first company to achieve the solution of converting inline defect coordinate into design layout coordinate accurately.
  A first Coordinate Conversion was first developed in early 2010. Soon, a revised Mask Frame-based Coordinate Conversion proved its accuracy in May, 2010 under all kind of wafer inspection conditions. The ESI OpenShort™ Coordinate Conversion Product paves the foundation to execute Killer Defect Index accurately.
  The ESI OpenShort™ Coordinate Conversion Product can be licensed and used in the application of Pattern Grouping in a systematic defect test, Killer Defect Index in a nuisance defect and killer defect classification, inline defect to design layout pattern for failure analysis, etc.